Microphone orientation and size in a speakerphone
US8116500B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2006 |
| Grant date | Feb 14, 2012 |
| Priority date | — |
| Expiry date | Apr 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/406
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In various embodiments, a speakerphone may comprise multiple (e.g., 16) microphones placed in a circular array around a central speaker. The microphones may be mounted vertically in the speakerphone with their respective diaphragms substantially parallel to the top surface of the speakerphone. The centrally mounted speaker may be coupled to a stiff internal speaker enclosure. The speaker enclosure may be made of a stiff, heavy material (e.g., a dense plastic) to prevent the speaker vibrations from excessively vibrating the speakerphone enclosure (which may affect the microphones). The speaker enclosure may also include a raised rim and ridges to increase its stiffness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.