Process for forming an isolated electrically conductive contact through a metal package
US8117744B2 · kind B2 · utility
2Cited by
34References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2011 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | Feb 14, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming an isolated electrically conductive contact through a metallic substrate includes creating at least one via through the substrate, where the via includes a first opening in a top surface of the substrate, a second opening in an opposing bottom surface and at least one continuous sidewall extending therebetween. A dielectric sleeve is formed on the at least one sidewall of the via while preserving at least a portion of the through via. An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.