Patent · US Active

Refrigeration apparatus having warm connection element and cold connection element and heat pipe connected to connection elements

US8117850B2 · kind B2 · utility

0Cited by

3References

16Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Marijn Pieter Oomen · Erlangen, DE
Peter van Hasselt · Erlangen, DE

Key dates

Filing date	Dec 14, 2007
Grant date	Feb 21, 2012
Priority date	—
Expiry date	Dec 20, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01F6/065
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A heat pipe arranged between warm and cold connection elements is intended to be filled at least partially with a refrigerant, which can be circulated in the heat pipe by a thermosiphon effect. The parts of a device, particularly in superconducting technology, which are to be cooled are connected to the warm connection element and a heat sink is connected to the cold connection element. To thermally separate the warm and cold connection elements, the refrigerant can be pumped off through the pipeline connected to the interior of the heat pipe.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.