Thermal management system with staged cooling
US8118257B2 · kind B2 · utility
8Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2006 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | May 30, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/50
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A thermal management system comprises a first heat exchanger having an inlet and an outlet, a second heat exchanger having an inlet and an outlet, a fluid loop, a first heat pump, and a second heat pump. The fluid loop circulates a fluid, and forms a continuous path between the first and second heat exchangers. The first heat pump is connected to the fluid loop and is disposed between the outlet of the second heat exchanger and the inlet of the first heat exchanger. The second heat pump is connected to the fluid loop and is disposed between the outlet of the first heat exchanger and the inlet of the second heat exchanger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.