Patent · US Active

Chemical mechanical polishing pad having window with integral identification feature

US8118641B2 · kind B2 · utility

27Cited by

19References

10Claims

0Family size

Assignee

Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

Mary Jo Kulp · Newark, US
Ethan S. Simon · Ambler, US
Darrell String · Havre de Grace, US

Key dates

Filing date	Mar 4, 2009
Grant date	Feb 21, 2012
Priority date	—
Expiry date	Jun 23, 2030

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B37/205
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Chemical mechanical polishing pads having a window with an integral identification feature, wherein the window has a polishing face and a nonpolishing face, wherein the integral identification feature is observable through the window, and wherein the integral identification feature identifies the chemical mechanical polishing pad as a type of chemical mechanical polishing pad selected from a plurality of types of chemical mechanical polishing pads. Also provided is a method of making such chemical mechanical polishing pads and for using them to polish a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.