Mix head assembly for forming chemical mechanical polishing pads

US8118897B2 · kind B2 · utility

Assignee

• Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

• John Esbenshade · Clayton, US
• Andrew M Geiger · Newark, US
• Paul Libbers · Claymont, US
• Samuel J. November · Newtown, US
• Paul J. Sacchetti · Warrington, US
• Jonathan Tracy · Pottstown, US
• David Verbaro · Cinnaminson, US
• Michael E Watkins · Bear, US

Key dates

• Filing date: Apr 11, 2011
• Grant date: Feb 21, 2012
• Expiry date: Apr 11, 2031

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B29B7/7471
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers is provided, wherein inclusions of entrained gas inclusion defects are minimized.