Encapsulated cure systems
US8119214B2 · kind B2 · utility
40Cited by
22References
50Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2005 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | Jul 7, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Encapsulated cure systems are provided wherein a curative is incorporated into a solid or semi-solid carrier material whereby mere fracturing or failure of the capsule wall encapsulating such cure systems will not provide for or allow sufficient release of the curative. Also provided are adhesive systems incorporating said encapsulated cure systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.