Patent · US Active

Composite material, especially multilayer material, and adhesive or bonding material

US8119220B2 · kind B2 · utility

1Cited by

3References

14Claims

0Family size

Assignee

Curamik Electronics GmbH · DE

Inventors

Xinhe Tang · Wien, AT
Ka Chun Tse · Sha Tin, CN
Ernst Hammel · Wien, AT
Ben Zhong Tang · 流花街道, CN

Key dates

Filing date	Aug 10, 2006
Grant date	Feb 21, 2012
Priority date	—
Expiry date	Aug 20, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31515
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Disclosed is a multilayer material in which at least two components are jointed to each other via an adhesive bond. The adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.