Contacts on diamond
US8119253B2 · kind B2 · utility
1Cited by
0References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 15, 2009 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | Mar 21, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A diamond substrate having a contact, wherein the contact comprises a diamond-like-carbon (DLC) layer on at least part of a surface of the diamond substrate; and at least one metal layer on at least part of the surface of the DLC layer. Methods for producing the same and devices comprising such a substrate are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.