Molding compounds with reduced anisotropy regarding impact resistance
US8119723B2 · kind B2 · utility
1Cited by
16References
24Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 18, 2008 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | Feb 18, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/035
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic molding composition, comprising the following amounts of components A, B, C, and D:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.