Patent · US Active

Molding compounds with reduced anisotropy regarding impact resistance

US8119723B2 · kind B2 · utility

1Cited by
16References
24Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 18, 2008
Grant dateFeb 21, 2012
Priority date
Expiry dateFeb 18, 2028

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2205/035
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A thermoplastic molding composition, comprising the following amounts of components A, B, C, and D:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.