Terminal assembly with regions of differing solderability
US8119926B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 1, 2009 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | Feb 19, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes an electrically conductive terminal including a first end and a second end opposed to the first end. The first and second ends are configured to receive a solder ball. An axial hole extends inward from the first end of the terminal, and an electrically conductive core member is disposed within the hole. The core member is sized and shaped to obstruct the hole. In addition, at least an outer surface of the core member includes a first material and at least an outer surface of the body includes a second material, the first material having greater solderability than the second material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.