Light emitting diode package having heat dissipating slugs
US8120054B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2008 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | Jan 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
Abstract
A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.