Patent · US Active

Airflow guiding and heat dissipating assembly for electronic device

US8120907B2 · kind B2 · utility

6Cited by

5References

16Claims

0Family size

Assignee

Acbel Polytech Inc. · TW

Inventors

Wen-hsiung Chen · Sunnyvale, US
Chien-An Chou · Taipei, TW
Chia-Hao Lin · Nagoya, JP

Key dates

Filing date	Jun 16, 2009
Grant date	Feb 21, 2012
Priority date	—
Expiry date	Dec 7, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An airflow guiding and heat dissipating assembly is mounted in an electronic device and has a base and at least one baffle being mounted on the base. Multiple electronic components are mounted on the base and are arranged in a line. Airflow flows along one electronic component upstream, past the baffle and then over the other electronic component downstream to take away heat from the electronic component. The baffle prevents the airflow from becoming turbulent and, therefore, temperatures of the electronic component are lowered efficiently.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.