Computer system with heat sink
US8120920B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2010 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | Sep 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A computer system includes a chassis, a motherboard secured to the chassis, and a heat sink. A chip is mounted on the motherboard. A securing component secured to the motherboard adjacent the chip. The securing component defines an opening. Two positioning posts are located on the motherboard and adjoin two opposite edges of the opening. Each positioning post defines a fastener hole. A heat sink includes a main body and a fin portion located on the fin portion. The main body defines two through holes. The main body defines two recesses to expose the through holes. The heat sink is secured to the securing component, by two fasteners engaged in the through holes and the fastener holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.