Surface mount silicon condenser microphone package
US8121331B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 19, 2011 |
| Grant date | Feb 21, 2012 |
| Priority date | — |
| Expiry date | May 19, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49798
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board. In some embodiments, the acoustic port is located in the substrate directly under the silicon condenser die which decreases the thickness of the inventive package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.