Insulating and heat dissipating panels
US8122666B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Aug 10, 2007 |
| Grant date | Feb 28, 2012 |
| Priority date | — |
| Expiry date | Oct 23, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B10/20
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Panels that provide structural integrity to building structures and enhance the insulation and heat dissipation capacity of a structure. The panels include an inner imperforate rigid layer of a first material, an outer rigid layer of a second material, and at least one intermediate rigid layer of a third material. The layers are positioned in a spaced relationship so that there are a first air space between the inner layer and the intermediate layer and a second air space between the intermediate layer and the outer layer. At least one pair of upper and lower openings are provided in the outer layer so that the second air space communicates with ambient air. Likewise, the intermediate layer includes at least one pair of upper and lower openings that communicate with the openings in the outer layer so that the first air space is also in fluid communication with the ambient air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.