Patent · US Active

Process for brazing wide gaps

US8123105B2 · kind B2 · utility

0Cited by

2References

9Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Raoul Galic · Wetter (Ruhr), DE
Brigitte Heinecke · Wetter (Ruhr), DE
Margarete Neuhaus · Ewighausen, DE
Claus Krusch · Wetter (Ruhr), DE
Volker Vosberg · Wetter (Ruhr), DE

Key dates

Filing date	Nov 11, 2008
Grant date	Feb 28, 2012
Priority date	—
Expiry date	Nov 11, 2028

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2101/001
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for repairing wider gaps in a substrate of a component by brazing at a brazing temperature is provided. Filler material and solder are prevented from separating in that, in a two-stage process, first the filler material and then the solder are applied to the wider gap. The powder does not melt at the brazing temperature and the filler metal does melt at the brazing temperature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.