Patent · US Active

Method for soldering with a multistep temperature profile

US8123110B2 · kind B2 · utility

2Cited by

19References

9Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Ingo Berger · Taufkirchen, DE
Jan Münzer · Berlin, DE
Ingo Reinkensmeier · Fritzlar, DE
Silke Settegast · Berlin, DE

Key dates

Filing date	Oct 4, 2010
Grant date	Feb 28, 2012
Priority date	—
Expiry date	Oct 4, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02T50/60
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at a temperature plateau with a temperature that is lower than a temperature of the previous plateau.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.