Methods and apparatus for an integrated instrumentation module for a thermal protection system
US8123174B2 · kind B2 · utility
1Cited by
2References
15Claims
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Key dates
| Filing date | Jun 20, 2007 |
| Grant date | Feb 28, 2012 |
| Priority date | — |
| Expiry date | Aug 8, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64G1/58
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
An integrated instrumentation system includes a body comprising a thermal protection system (TPS) material (e.g., an ablatable material), one or more sensors embedded within the body, and a processor (e.g., an FPGA or the like) communicatively coupled to the plurality of sensors. The processor is configured to acquire sensor signals from the plurality of sensors and produce digital sensor data associated therewith. The sensors may include, for example, recession sensors, pressure transducers, thermocouples, and accelerometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.