Circuit board for ink jet head, ink jet head having the same, method for cleaning the head and ink jet printing apparatus using the head
US8123330B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2011 |
| Grant date | Feb 28, 2012 |
| Priority date | — |
| Expiry date | Apr 26, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/03
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
In an ink jet head using a thermal energy for ejecting ink, this invention aims to reliably and uniformly remove kogations deposited on a heat application portion in contact with the ink. To realize this objective, the upper protective layer is arranged in an area including the heat application portion so that it can be electrically connected to serve as an electrode which causes an electrochemical reaction with the ink. The upper protective layer is formed of a material containing a metal which is dissolved by the electrochemical reaction and which does not form, on heating, an oxide film which hinders the dissolution. With this arrangement, a reliable electrochemical reaction can be produced to dissolve a surface layer of the upper protective layer, thereby removing kogations on the heat application portion reliably and uniformly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.