Halogen-free resin composition with high frequency dielectric property, and prepreg and laminate made therefrom
US8124674B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2010 |
| Grant date | Feb 28, 2012 |
| Priority date | — |
| Expiry date | Mar 1, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a halogen-free resin composition with high frequency dielectric property, and a prepreg and a laminate made therefrom. The halogen-free resin composition with high frequency dielectric property comprises, calculating according to the parts by weight of organic solids: (A) 10-50 parts by weight of copolymer of styrene-maleic anhydride; (B) 10-50 parts by weight of at least one compound having dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one polyepoxide; (D) 5-30 parts by weight of at least one phosphorus-containing flame retardant. Prepregs and laminates made from the resin composition have low dielectric constant, low dielectric dissipation factor, high glass transition temperature, high heat resistance, low moisture adsorption, and the technological operation is simple.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.