Semiconductive polymer composition
US8124877B2 · kind B2 · utility
2Cited by
17References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2005 |
| Grant date | Feb 28, 2012 |
| Priority date | — |
| Expiry date | Dec 6, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2958
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a semiconductive polymer composition for use in power cables. The composition comprises a multimodal ethylene homo- or copolymer produced in a polymerization process comprising a single site catalyst whereby the polymer composition has a density of 870 to 930 kg/m3, a MFR2 of 1 to 30 g/10 min and a Mw/Mn of less than or equal to 10.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.