Semiconductor package and method of manufacturing the same
US8125042B2 · kind B2 · utility
7Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2009 |
| Grant date | Feb 28, 2012 |
| Priority date | — |
| Expiry date | Jan 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
Abstract
Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.