Patent · US Active

Substrate for wiring, semiconductor device for stacking using the same, and stacked semiconductor module

US8125792B2 · kind B2 · utility

3Cited by
8References
16Claims
0Family size

Assignee

Inventor

Key dates

Filing dateDec 9, 2008
Grant dateFeb 28, 2012
Priority date—
Expiry dateSep 4, 2030

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/175
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

In a stacked semiconductor module, a test covering connecting terminals is easily conducted and high reliability is achieved.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.