Thermal expansion compensator having an elastic conductive element bonded to two facing surfaces
US8128418B1 · kind B1 · utility
1Cited by
12References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2010 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Oct 8, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49888
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A thermal expansion compensator is provided and includes a first electrode structure having a first surface, a second electrode structure having a second surface facing the first surface and an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate, the conductive element having a length that is not substantially longer than a distance between the first and second surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.