Polymer particles, conductive particles, and an anisotropic conductive packaging materials containing the same
US8129023B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2007 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Jun 4, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.