Patent · US Active

High strength and high thermal conductivity heat transfer apparatus

US8129036B2 · kind B2 · utility

5Cited by

13References

7Claims

0Family size

Assignee

HAMILTON SUNDSTRAND SPACE SYSTEMS INTERNATIONAL, INC. · US

Inventors

Durwood M. Beringer · Suffield, US
Kenneth J. Zacharias · Windsor, US
Jesse Joseph Stieber · Avon, US
Edmund P. Taddey · West Springfield, US
Stephen A. Yaworski · Tolland, US
Gregory K. Schwalm · Avon, US

Key dates

Filing date	May 13, 2008
Grant date	Mar 6, 2012
Priority date	—
Expiry date	Aug 14, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/12979
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A heat transfer apparatus includes a first protective layer of a first metallic material, a second protective layer of a second metallic material, and a heat transfer layer bonded between the first protective layer and the second protective layer. The heat transfer layer is made of a metal matrix composite, such as aluminum oxide reinforcement dispersed within a copper matrix.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.