Nanotube modified solder thermal intermediate structure, systems, and methods
US8129223B2 · kind B2 · utility
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22References
20Claims
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Key dates
| Filing date | Feb 19, 2007 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Jan 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.