Photosensitive-resin remover composition and method of fabricating semiconductor device using the same
US8129322B2 · kind B2 · utility
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11References
3Claims
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Key dates
| Filing date | Mar 3, 2011 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Mar 3, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive-resin remover composition includes an amine compound and de-ionized water, an amount of the de-ionized water being about 45% to about 99% by weight based on a total weight of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.