Side view LED package and back light module comprising the same
US8129740B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2009 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Oct 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a side view LED package that can be more accurately mounted onto a surface of a substrate such as a printed circuit board without distortion includes a first portion of a body allowing light to be emitted in front thereof, the first portion having a horizontal plane formed on a top or bottom side thereof; and a second portion of the body positioned backward with respect to a back end boundary line of the first portion, the second portion being formed with an inclined plane that is adjacent to the horizontal plane and has height decreased from the back end boundary line, wherein the inclined plane is partially formed with an added thickness portion that is flush with the horizontal plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.