Light emitting diode package
US8129741B2 · kind B2 · utility
4Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2009 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Dec 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a light emitting diode package including: a package mold having a first cavity and a second cavity with a smaller size than that of the first cavity; first and second electrode pads provided on the bottom surfaces of the first cavity and the second cavity, respectively; an LED chip mounted on the first electrode pad; a wire for providing electrical connection between the LED chip and the second electrode pad; and a molding material filled within the first cavity and the second cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.