Housed active microstructures with direct contacting to a substrate
US8129838B2 · kind B2 · utility
8Cited by
3References
35Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 14, 2008 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Jul 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microstructured component with microsensors or other active microcomponent is provided. The microstructured component includes a substrate and at least one housing arranged on the substrate with one or more active microstructures situated on it.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.