Patent · US Active

Heat sink of at least one electronic component

US8130498B2 · kind B2 · utility

5Cited by

17References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Bernd Wirnitzer · Echterdingen, DE
Jan Breitenbach · Stuttgart, DE
Andreas Kynast · Hildesheim, DE
Thorsten Seidel · Waiblingen, DE

Key dates

Filing date	Nov 11, 2008
Grant date	Mar 6, 2012
Priority date	—
Expiry date	Nov 11, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a cooling body of at least one electrical component. According to the invention, a first cooling body section is designed as a spring and a contact surface is provided on the first cooling body section, between the cooling body and the at least one component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.