Thermal conductive member, manufacturing method of the thermal conductive member, heat radiating component, and semiconductor package
US8130500B2 · kind B2 · utility
11Cited by
3References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 28, 2010 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | Sep 28, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal conductive member includes linear high thermal conductivity materials; a first solder layer provided at first end sides of the linear high thermal conductivity materials; and a second solder layer provided at second end sides of the linear high thermal conductivity materials; wherein at least one of the first end sides and the second end sides of the linear high thermal conductivity materials are connected to the first solder layer or the second solder layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.