Methods of manufacturing a hermetic lead connector
US8131370B2 · kind B2 · utility
19Cited by
15References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2007 |
| Grant date | Mar 6, 2012 |
| Priority date | — |
| Expiry date | May 25, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.