Laser induced bond delamination
US8132460B1 · kind B1 · utility
11Cited by
39References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2009 |
| Grant date | Mar 13, 2012 |
| Priority date | — |
| Expiry date | Nov 4, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2694
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods, systems, and apparatuses are provided for creating bond delaminations in a controlled fashion within adhesively bonded structures. In one embodiment, a system for inducing a defect in a bond of a bonded article includes a laser and a laser processor head. The laser processor head includes a housing, a lens disposed within the housing, at least one magnet disposed within the housing, and at least one sensor disposed within the housing. The system is capable of applying a laser pulse of sufficient energy fluence to cause localized weaknesses in the bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.