Semiconductor device and method for manufacturing same
US8132709B2 · kind B2 · utility
6Cited by
32References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2007 |
| Grant date | Mar 13, 2012 |
| Priority date | — |
| Expiry date | Dec 28, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a semiconductor element having electrodes, a metal member, wires that electrically connect the semiconductor element and the metal member and/or electrodes within the semiconductor element, wherein the wires constitute at least a first wire loop and a second wire loop, the first wire loop is bonded at one end to a first bonding point and at the other end to a second bonding point, and has a flat part which includes the surface of a boll part and the wire located contiguously the ball part surface, and the second wire loop connects the surface of the ball part and a third bonding point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.