Patent · US Active

Printhead assembly with molded ink manifold having polymer coating

US8132893B2 · kind B2 · utility

0Cited by

1References

10Claims

0Family size

Assignee

Silverbrook Research Pty Ltd · AU

Inventors

Seung Jin Lee · Suneung-ri, KR
Susan Williams · Sydney, AU
Jan Waszczuk · Sydney, AU
Kia Silverbrook · Sydney, AU

Key dates

Filing date	Aug 21, 2011
Grant date	Mar 13, 2012
Priority date	—
Expiry date	Aug 21, 2031

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB41J2002/14419
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

A printhead assembly includes: a molded ink manifold having a plurality of ink outlets defined in a manifold bonding surface; and printhead integrated circuits bonded to the manifold bonding surface. The manifold bonding surface includes a polymer coating, which plugs fissures in the molded ink manifold.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.