Method for forming a back-to-back wafer batch to be positioned in a process boot, and handling system for forming the BTB wafer batch

US8133002B2 · kind B2 · utility

Assignee

• JONAS & REDMANN AUTOMATIONSTECHNIK GMBH · DE

Inventors

• Stefan Jonas · Berlin, DE
• Lutz Redmann · Kleinmachnow, DE

Key dates

• Filing date: Nov 22, 2007
• Grant date: Mar 13, 2012
• Expiry date: Jun 24, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of forming stacks of wafers. One half of the number of the wafers provided serially in the transfer carrier is transferred out of the transfer carrier in the form of a first wafer stack in a mounted standby position located outside of the transfer carrier, then the other half of the number of wafers serially provided in the transfer carrier is moved out of the transfer carrier in the form of a second wafer stack and the second wafer stack is swiveled so that the wafers of the second wafer stack reach a position swiveled by 180° in relation to the position of the wafers of the first wafer stack in its standby position. The second wafer stack is transferred to the standby position of the first wafer stack, aligned to it and then joined together as form fitting with the first wafer stack.