Diamond heat sink in a laser
US8133320B2 · kind B2 · utility
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4References
43Claims
0Family size
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Inventor
Key dates
| Filing date | Aug 24, 2004 |
| Grant date | Mar 13, 2012 |
| Priority date | — |
| Expiry date | Apr 18, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser has a laser material in thermal contact with a diamond, such that the diamond is operable to carry heat away from the laser material. In further embodiments, the diamond has a reduced nitrogen content, is a reduced carbon-13 content, is a monocrystalline or multilayer low-strain diamond, or has a thermal conductivity of greater than 2200 W/mK.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.