Patent · US Active

Physical vapor deposition with multi-point clamp

US8133362B2 · kind B2 · utility

1Cited by

16References

25Claims

0Family size

Assignee

FUJIFILM Corporation · JP

Inventors

Jeffrey Birkmeyer · San Jose, US
Youming Li · San Jose, US
Steve Deming · San Jose, US
Mats G. Ottosson · Boo, SE

Key dates

Filing date	Feb 26, 2010
Grant date	Mar 13, 2012
Priority date	—
Expiry date	Apr 20, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3405
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, a clamp configured to hold the substrate to the chuck, wherein the clamp is electrically conductive, and a plurality of conductive electrodes attached to the clamp, each electrode configured to compress when contacted by the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.