Sputtering system and method using a loose granular sputtering target
US8133367B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 11, 2006 |
| Grant date | Mar 13, 2012 |
| Priority date | — |
| Expiry date | Aug 2, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3414
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Sputtering is performed using a sputtering system having a sputtering source having a sputtering medium, a sputtering target positioned so as to be impinged upon by the sputtering medium of the sputtering source, wherein the sputtering target comprises a mass of a first loose granular material, and an open-top vessel in which the mass of the first loose granular material of the sputtering target is received and positioned so that the first loose granular material does not fall out of the open-top vessel by gravity. Some of the first loose granular material is sputtered from the sputtering target, a quantity of a second loose granular material is added to the mass of the first loose granular material in the open-top vessel, and thereafter some of the second loose granular material is sputtered from the sputtering target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.