Anisotropic conductive film
US8133412B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2009 |
| Grant date | Mar 13, 2012 |
| Priority date | — |
| Expiry date | Nov 12, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2857
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An anisotropic conductive film 2 contains electrically conductive particles 6 dispersed in an adhesive agent 30 for electrode connection, the adhesive agent containing an epoxy resin, which is an insulating thermosetting resin, as a main component, a phenoxy resin having a molecular weight of 30,000 or more, a latent hardener, a polyvinyl butyral resin having a glass-transition temperature of 100° C. or higher, and a polyvinyl butyral resin having a glass-transition temperature of 90° C. or lower. There is provided the high-heat-resistant anisotropic conductive film which suppresses a reduction in repairability and which can be used for electrodes having a finer pitch, i.e., having a minimum pitch of 150 μm or less, when electrodes are connected with the anisotropic conductive film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.