Multilayer heat sealant structures, packages and methods of making the same
US8133560B2 · kind B2 · utility
2Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2011 |
| Grant date | Mar 13, 2012 |
| Priority date | — |
| Expiry date | Sep 22, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The embodiments of the present invention relate to multilayer thermoplastic structures having improved sealability and tearability. More specifically, the present invention relates to a multilayer heat sealant structure having at least three layers that may be coextrusion coated or otherwise laminated to a substrate, such as metallized polymeric material, foil, or other substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.