Electronic or optoelectronic assembly with an electromagnetic screening structure, method for manufacturing same
US8134087B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2007 |
| Grant date | Mar 13, 2012 |
| Priority date | — |
| Expiry date | Jan 11, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to an electromagnetic screening structure on or in a non-conductive carrier material in which non-conductive metal compounds are placed. The screening structure comprises a flat metal seed layer formed on or in the carrier material, which is formed through metal seeds that have been released through electromagnetic radiation, and a flat metal coating which is applied over the metal seed layer and which is in contact with said metal seed layer. The invention additionally relates to an electronic or optoelectronic used with the screening structure and a method for manufacturing the screening structure. In a further aspect of the invention, an electronic or optoelectronic assembly is provided with a carrier element, wherein at least one additional electrical or optoelectronic component is arranged on the surface of the carrier material and is in contact with conductor path structures formed on the carrier surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.