Layered thin-type keycap structure
US8134094B2 · kind B2 · utility
54Cited by
5References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2009 |
| Grant date | Mar 13, 2012 |
| Priority date | — |
| Expiry date | Nov 27, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thin-type keycap structure comprising a key cap layer and a plastic film on the upper surface of the key cap layer. The thin-type keycap structure and the metal dome on a PCB are assembled to form a keypad structure. The thin-type keycap structure is made through compression molding of the plastic film and a resin together. The surface of the plastic film may be embossed before the compression molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.