Electrical component with a sensor element, method for the encapsulation of a sensor element, and method for production of a plate arrangement
US8134446B2 · kind B2 · utility
3Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2009 |
| Grant date | Mar 13, 2012 |
| Priority date | — |
| Expiry date | Sep 28, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical component is specified with a sensor element, which is embedded in a plate arrangement. The plate arrangement includes at least three plates and conductor tracks, which are located between them and are conductively connected with the sensor element. At least two of the conductor tracks have exposed areas. Furthermore, a method for the encapsulation of a sensor element and a method for the production of a plate arrangement are specified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.