Twist-secured assembly of a power semiconductor module mountable on a heat sink

US8134837B2 · kind B2 · utility

Inventors

• Olaf Hohlfeld · Warstein, DE
• Peter Kanschat · Soest, DE
• Thilo Stolze · Arnsberg, DE

Key dates

• Filing date: May 11, 2010
• Grant date: Mar 13, 2012
• Expiry date: May 18, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A power semiconductor module system includes a power semiconductor module, a heat sink and at least one fastener. The power semiconductor module includes a bottom side with a first thermal contact surface and the heat sink includes a top side with a second thermal contact surface. The power semiconductor module is conjoined with the heat sink by means of the at least one fastener. The power semiconductor module includes a number N1≧1 of first positioning elements and the heat sink a number N2≧1 of second positioning elements. Each of the first positioning elements corresponds to one of the second positioning elements and forms a pair therewith. The power semiconductor module and the heat sink are alignable relative to one another so that the two positioning elements of each of the pairs are interfitted when the power semiconductor module is mounted on the heat sink.