Packaged sensors and harsh environment systems with packaged sensors
US8135247B2 · kind B2 · utility
5Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2009 |
| Grant date | Mar 13, 2012 |
| Priority date | — |
| Expiry date | Aug 13, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/2558
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A fiber sensor package is disclosed. The fiber sensor package includes an interconnection between a first optical fiber and a second optical fiber within a tubing such that the first and second optical fibers are at least partially disposed within that tubing. A bonding material is disposed across an edge of the interconnection around at least a part of the circumferential surfaces of the first and second fibers, holds rigid the interconnection of the first and second optical fibers. The methods of preparing the package, and the examples of systems benefiting from the fiber sensor package of this invention are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.