Electronic component mounter and mounting method
US8136219B2 · kind B2 · utility
3Cited by
16References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2006 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Jun 14, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter (100) equipped with a transfer head (8) having a component-sucking-and-holding nozzle (21), for transferring a component P and mounting the component P onto a board (3), and includes: lowering the component P to within the high-accuracy range of a first line sensor (13) for measuring the height of the component P; and measuring the height of the component P using the first line sensor (13).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.